A printed circuit board or PCB is a core component of nearly all electronic devices. Everything except the simplest of electronics uses a board of some kind to connect and mechanically sync all elements of the product. A coffee maker, for instance, might have a small PCB inside to connect the electronic control system, heater element and display. In the early days—way before design software was a thing—printed circuit boards were planned using Mylar sheets through manual hands-on development, and were often four times bigger than the circuit board itself. The designers would lay pin pads, traces and components out in a proposed design, which was used sort-of like a storyboard to test and explain circuits. Today, it’s all done via design and manufacturing software. It’s important to understand that circuit board repair parts and practices often consist of the same materials and components used to build the hardware in the first place. There are very few substitutes or alternatives, especially when talking about reliable and conductive materials. This highlights the need to find a proper, professional repair team with the right assets and connections.If you want to order PCB product, please check and custom your order online. What are the causes of PCB failures？ As with anything that deteriorates over time and extended use, printed circuit boards can run into a variety of problems. From trace damage which affects the conductivity of the board and circuit to component failure which sees capacitors or diodes dying, there are many points of contention on a circuit board. It helps to identify and understand some of the most common failures, that way you can deal with the problem in a relevant manner. This may also help people—who don’t have direct experience with circuit boards—keep them in better shape. 1. Physical DamageThis is the more obvious choice when it pertains to the damage of a circuit board. In fact, the most common causes of PCB failures all stem from physical damage to a device or its internals. This can be just about anything pertaining to physical pressure or shock. The device in question might have been dropped from a great distance. Perhaps it was smacked or hit forcibly by another object? There’s also the possibility that the device was disassembled for whatever reason, and damage happened directly to the board. How to Repair?So long as complete failure is not the scenario—the board fell upon the ground and shattered or broke completely—physical damage can be remedied through the remanufacturing process. Generally, this involves melting down the damage sections of the board or repairing through disassembly and reassembly. Due to the nature of most physical damage, it’s highly unlikely that this can be done as a DIY project by those without experience with printed circuit board repair. The repair of physical damage should only be done by a trained and experienced professional. In most cases, it calls for remodeling of the board, resoldering of components, and the reballing of conductive traces. 2. Component FailureAside from physical damage, faulty components are the other most common cause of printed circuit board failures. In fact, if and when there is no physical damage but a device has failed to operate or power on, you can almost guarantee it has to do with one of the components connected to the board. The component itself could be anything from a capacitor to a diode or microprocessor. If the component is the issue and has died or failed to work, it may need to be replaced entirely. However, it’s not always the actual component that’s the problem. Sometimes due to aging, overheating and voltage sags the trace circuit may have deteriorated to a point where it’s no longer conductive. It’s also possible that a component—or several—have dislodged entirely from the board and need to be reseated. How to Repair?You may be asking, how to fix a printed circuit board when a component fails? Again, the repair and manufacturing process for faulty components is best left to professionals. There are voltage tools and various devices that can be used to test the conductivity of a board’s circuit. They can also be used to discern if there’s electricity flowing to a component, or if an element of the board has failed entirely. A lot of times, by just opening up the device you can see components that have failed. Their outer shell may seem burnt, cracked or broken, or the component is completely detached from the board and loose. To repair a faulty component, you may need to apply heat—usually with a heat gun—solder and conduct rigorous testing. 3. Trace DamageTraces on a circuit board are the conductive pathways comprised of silver or copper. Generally, you can see an issue with traces using the naked eye, but not always. If a trace suffers damage, whether through regular use or physical damage then it can cause significant issues with the printed circuit boards conductivity, components and the device in question. Some of the more common reasons for trace damage include lightning strikes, severe power surges or shorts, metallic dust contamination, overheating and normal wear. How to Repair?Provided the trace is not incredibly thin and difficult to see, you can usually discern damage simply by scanning the pathway. Copper and silver by nature are bright and shiny, which makes it easier to identify when there’s a break or damage. Keep in mind this is not always the case, but it’s a sure bet. To repair faulty or damage trace pathways, you simply need to resolder or reball the board with the necessary material. This reconnects the broken circuit and allows electricity to flow freely throughout the board. 4. Poor DesignAs much as we’d love to praise every single engineer or product developer in existence, that’s just not viable. Sometimes, for whatever reason, a team may cut corners when designing a board or manufacturing the necessary components. This can result in the poor design and construction of a board, which causes issues later down the line. Unfortunately, poor design for a printed circuit board can lead to several things, many of the failures that happen are already discussed here. How to Repair?You’ll know as soon as you have a faulty or poor circuit board because your device will continue to fail time and time again, even after a repair or service session. The best solution for a shoddy circuit board is to replace it completely, by visiting an official or licensed repair center. The easiest way to identify a poorly designed board is the number of failures or problems after extended use. Barring significant physical or electrical damage to the device, if you take the board to be repaired or analyzed somewhere and there are a handful of issues, there’s likely something wrong with the way the board was constructed. In some cases, this simply means the original manufacturer used cheap or unreliable components, but the board itself is fine. Wanna know PCB knowledge? Check and read for more.
PCB Glossary ⋅ 07/20/2021 09:12
X-ray inspection system PCB
What is X-ray inspection during the PCB manufacturing? How does it work? In this passage we will focus on X-ray inspection system and provide everything about it. If you are curious about it please check the content we prepare for you below.If you want to order PCB product, please check and custom your order online. What is the definition of X-ray inspection? X-ray inspection technology, also referred to as automated x-ray inspection, is a technology that can find hidden features within a target object. From the medical industry to aerospace manufacturing, x-ray inspection is a widely used method to identify manufacturing errors. It is especially prevalent in PCB inspection, as x-rays are an excellent way to test PCB quality and find hidden defects without risking damage to the board. In this guide, we’ll discuss what x-ray inspection is, how it works and what it’s benefits are, so you understand how to leverage PCB x-ray inspection for your company’s purposes. Why X-ray inspection is popular during PCB manufacturing? Electronics manufacturing has consistently become more sophisticated over the past several decades, with electronics in industrial, communication, military and aerospace industries advancing in ways that make inspection significantly more difficult. Some of the most significant trends that negatively affect inspection include: · Component placement: Equipment is becoming smaller and more layered to save space and maximize functionality. As a result, many solder joints and components are being moved to inner layers within electronics, either placed between PCB layers or hidden within the final product itself.· Component size: More circuit board components are trending toward miniaturization. With the need to create more dense boards, PCB components are expected to continue toward this trend.· SMT: Surface mount technology makes leads and packages smaller, which has resulted in PCBs having higher density with more components hidden between layers. The increasing density, decreasing size and more complex placement of PCBs and their components have made it nearly impossible for traditional inspection methods to find faults thoroughly. Optical, ultrasonic and thermal imaging methods are relatively ineffective due to the density of modern PCBs. However, x-ray inspection can collect detailed images where these other methods cannot. X-ray has the ability to penetrate layers of PCB to inspect inner layers and packaging, making it more useful for inspecting the solder joints of complex PCB assemblies. For this reason, PCB inspection with x-ray technology is becoming increasingly popular. What are the working the principles of X-ray inspection? To understand what x-ray PCB inspection is, you first need to know how x-ray inspection works. All x-ray inspection devices are made up of three basic features: · X-ray tube: This tube has the ability to generate x-ray photons.· Platform: The operation platform moves the sample in different directions, allowing it to be inspected from various angles and magnitudes.· Detector: The detector on the other side of the sample catches and collects x-ray photons, converting them into an image. X-ray imaging works using x-ray photons, which are passed through a material and collected on the other side. The x-ray photons pass through materials differently based on their physical properties, including atomic weight, density and thickness. Generally, heavier elements absorb more x-ray photons, making them easier to image, while lighter elements are more transparent. Because different materials behave uniquely, differing amounts of photons are collected on the other side of the object, resulting in an image. Components in a PCB typically consist of heavier elements, making them easy to see on an x-ray image. What are the advantages of X-ray inspection? In x-ray images of PCBs, the metal is dark while other materials like glass, plastic and ceramics are transparent. This makes it easy to see metallic components. Combined with magnification capabilities, this allows inspectors to see various metallic parts on a board during PCB inspection with x-ray equipment. The x-ray will enable inspectors to see multiple qualities of a printed circuit and identify a range of potential problems, including: · Solder bridges: Solder bridges are a common problem on circuit boards. This occurs when solder joints are too close or creates a connection where there should be none. These solder problems are typically hidden by other components, making them difficult to spot with optical inspections, but x-rays identify them easily.· Solder voids: Solder voids are created when gas or flux is entrapped during soldering, often as a result of water contamination of solder paste. These voids decrease heat conductivity at the solder joint and can cause physical defects and reduced reliability. X-ray is one of the only ways to identify solder voids, so it is essential to use regularly to ensure product and process quality.· Pin-hole fills: Inadequate pin-hole fill for through-hole connectors is a prevalent issue in circuit boards. X-ray machines can be used to identify these errors and even quantify the amount of fill missing using coordinate measurements. One specific example of how x-ray is used is in a ball grid array (BGA) inspection. A BGA is a surface mount device that uses an array of metal spheres made of solder to make connections. This type of device is popular, as it enables high-density connections without complicating the PCB layouts. The difficulty with BGAs, however, is that the connections are made on the underside of the BGA chip. This feature, as well as the density of the solder balls, makes it difficult to solder and de-solder and increases the likelihood of forming solder bridges. The location also makes BGA chip solder joints particularly difficult to inspect. X-ray simplifies the inspection process by looking through the device to see the solder joints underneath, easily identifying bridges. With magnification and the capability to change the viewing angle, x-ray machines can be used to find these problems and more. Even better, all of these problems may be identified during a single inspection because, unlike medical imaging, operators do not need to worry about radiation dose during operation and can use the equipment for as long as they need.Wanna know PCB knowledge? Check and read for more.
PCB Glossary ⋅ 07/17/2021 17:13
PCB conformal coating
To prevent PCB’s exposure to environmental hazards such as extreme temperature, humidity, corrosion and dust, conformal coating. Is one of the protective measures to avoid it being exposed to a range of unique environments. Any of these environmental conditions harm the components’ integrity and functionality. In this passage we will provide all the professional knowledge of conformal coating. And if you are searching for the information about it, please check and read the content we prepare below.If you want to order PCB product, please check and custom your order online. What is the definition of conformal coating? What is conformal coating and what is it used for? In short, conformal coating is a thin, transparent film that can be applied to the surface of a circuit board. This film contours to the PCB’s shape, protecting components from environmental conditions without impacting functionality. But is conformal coating necessary? While not all applications are best served by conformal coating, it can be an excellent choice for specific types of PCBs. Some of the benefits conformal coating offers include the following: · Protection: Conformal coatings protect assemblies from environmental hazards such as chemicals, corrosion and dust.· Lightweight: PCB conformal coatings do not significantly increase the board’s weight.· Insulation: Conformal coating provides insulating properties, allowing a reduction in PCB conductor spacing. These benefits are all provided without needing sophisticated or highly designed protective elements. What is the working principle of conformal coating on PCB? Conformal coatings may be applied to circuit boards using various methods, which differ in quality level, reliability and production level. The most notable application methods include the following: · Brush method: In this technique, conformal coating materials are applied by hand using a brush. These coatings tend to be thick and less consistent than those applied by other methods. This process is simple and labor-intensive and best suited for low-volume production and rework and repair operations.· Spray method: The spray method involves using an aerosol spray to apply conformal coating materials to PCB surfaces. Ideal for low-volume production, this technique provides an excellent surface finish consistency but is also time-consuming as it requires a thorough application to cover the entire board.· Dipping method: The dipping method involves applying conformal coating to circuit boards by submerging them in the coating solution. Fast, accurate and thorough, this method is ideal for high-volume production. However, it is only useable on certain types of PCBs with designs that prevent leakage and can be coated on both sides of the board.· Selective coating: The selective coating method uses robotic spray nozzles to apply coating materials to specified areas of a PCB assembly. This automated process is ideal for high-volume applications, offering a fast and accurate procedure that can be used on a wide range of boards. Like the dipping method, the board must be designed to be compatible with selective coating. With each of these application methods, the conformal coating must be very thin to minimize heat entrapment and weight increase, among other concerns. Typically, conformal coatings are between 3 to 8 mil thick. How do you measure conformal coating? This is usually done with a micrometer, current probe or specialized gauge that uses physical measurements, electromagnetic fields or ultrasonic waves to take measurements of the coating after it is dry. What are the types of conformal coating? Many types of conformal coating materials exist, including a range of specialty varieties. The most common of these conformal coatings are described below, along with their most prevalent applications: · Urethane resin: Urethane resins (UR) or polyurethane resins are known for their excellent resistance to moisture, abrasion and chemical attacks. The downside of this material is that it is resistant to solvents, meaning it is difficult to remove and rework. Urethane resins are most commonly used in aerospace applications where components may be exposed to corrosive fuel vapors.· Acrylic resin: Acrylic resins (AR) are acrylic polymers dissolved in a solvent. These substances require a simple drying process and are easy to rework. When complete, this type of coating provides good general protection against humidity and other environmental factors but poor protection from solvents and chemical vapors, making it most suitable for basic-level protection. The major upside of this material is the ease with which it can be removed and reworked, making it practical for repair operations.· Epoxy resin: Epoxy resin (ER) coatings are compounds that create a hard layer with good humidity, abrasion and chemical resistance, with minimal permeability. Less flexible than other types of coatings, epoxy resins are difficult to remove and rework. Epoxy is the most common choice for PCBs that need to be coated completely and is often chosen for applications with low mechanical stress.· Silicone resin: Silicone resin (SR) coatings provide excellent thermal, chemical, moisture and corrosion resistance while maintaining good flexibility. This type of coating is difficult to remove and offers poor abrasion resistance due to the surface’s rubbery texture. However, it makes up for this in offering good resilience against vibrational stress. Silicone resin conformal coatings are often chosen for electronics in outdoor environments that are exposed to broad temperature and moisture conditions.· Parylene: Parylene (XY) coatings are applied through chemical vapor deposition. In this process, the parylene is heated to become a gas and put into a vacuum chamber to polymerize and turn into a thin film, which is placed over electronics. This film offers excellent dielectric strength and resistance to extreme temperatures, moisture and corrosive elements. However, it is also difficult to remove and rework, requiring abrasion techniques to remove. The specialized production process also makes replacing parylene coating more difficult than other methods. It’s often used in specialty applications. When considering what types of conformal coating are best suited for your application, consider the application’s requirements, including the required functionality and environmental conditions in which the PCB will operate.Wanna know PCB knowledge? Check and read for more.
PCB Glossary ⋅ 07/17/2021 17:09
During the PCB manufacturing process, CNC milling as a very important step, will influence the performance and quality of the finished boards. In this passage we are talking about CNC milling, and please check and read the content we prepare for you below.If you want to order PCB product, please check and custom your order online. What is the definition of CNC milling？ CNC is the abbreviation of computer numerical control. This means that the milling machine is pushed and regulated numerically rather than by hand. CNC milling tools use extreme accuracy to conduct a machining operation comparable to grinding and cutting bits, leaving little space for human error. Though it can handle precise sizes and shapes of all types of products, the method is becoming a more common industrial solution. It is being used in a wide range of emerging systems and machinery. A CNC mill is perhaps the most common type of machine used in this field. It is a somewhat close method to drilling or cutting, and it can execute these procedures for a wide range of manufacturing needs. Milling makes use of a spherical cutting tool that can spin in many directions. A milling cutter, unlike a conventional drill, can travel around several axes. It can also generate a broad range of shapes, slots, holes, and other required impressions. Furthermore, the workpiece of a CNC mill may be pushed in particular guidance around the milling tool. A drill can only move around a single axis, limiting its total output ability. What are the classifications CNC milling？ CNC mills are sometimes classified according to the number of axes on which they can work. Each axis is labeled with a different letter. The X and Y axes, for example, reflect the lateral rotation of the mill’s work piece. The Z-axis represents vertical rotation. The W axis represents the diagonal rotation through the vertical plane. The number of CNC milling machines has three to five axes. To function correctly, more modern mills must be programmed with CAM technology. These sophisticated CNC machines can create forms that are almost difficult to create user manual tooling techniques. Furthermore, most CNC mills are outfitted with a unique system that supplies fluid to the cutting tool during the manufacturing method. CNC Milling Machines are valuable equipment for commercial and industrial processing. CNC Milling materials may support the aerospace industry, the medical industry, and the electronics industry. What re the working principles of CNC milling？ Machines are controlled numerically in CNC, where a software program is assigned to manage an entity. The language used in CNC machining is known as G-code, and it is used to monitor the different behaviors of an interconnected system, such as velocity, flow rate, and cooperation. CNC machining, in essence, allows you to pre-program the speed and location of machine tool functions and operate them in routine, predetermined cycles through software, all with no input from human operators. Because of these capacities, the process has been embraced in the manufacturing industry, and it is essential in the areas of metal and plastic processing. A CNC Milling Machine is a machine that uses a spinning cylindrical cutter to drive along several axes and cut slots, gaps, and information in material to produce a vehicle or mechanical component. Modern CNC milling machines may be configured as horizontal or vertical machining hubs. Plastics, ceramics, and composite materials, in addition to metals, can be used to make components. Remote tool changers, tool carousels and magazines, coolant devices, and enclosures are among the technical features that keep machines working smoothly without human intervention. The CNC milling process is used in the vast majority of tangible goods of global industrial production in some way or another. Although it only directly produces a limited percentage of components, it is the most popular way of creating tooling, so it is impossible to eliminate. CNC milling operations nearly all come into play in the course of getting new goods to life, and it’s a good idea to be familiar with the CNC milling process. Milling operations include driving a rotating sharp cutting tool through a firm block of material to whittle away at it until you have the desired final form. The CNC (Computer Numerical Control) component integrates a computer into the mechanism to automate precise motions in highly complicated ways. Computers can push CNC mills by exact movements to cut out the pieces you need as long as the tools are sharp and the equipment is manually oriented for the tools to hit. The following steps are included in the simple CNC machining process: 1. Design of CAD Models: The construction of a 2D variable or 3D vital element is the first step in CNC machining. The CNC machine’s and tooling’s abilities restrict the designs for CNC machined parts. Like, though most CNC machine tooling is cylindrical, the component configurations created through the CNC machining process are restricted because the tooling produces bend part bits. Furthermore, the machined product’s features, tooling set up, and machine work keeping capacity restrict Low component widths and maximum part heights are examples of different designs, and the presence and difficulty of tiny pores or requirements. 2. Installation of CAD files: The formatted CAD specification file is processed by an application, usual software for computer-aided manufacturing, which captures a component commutative and produces the program for automated programming that controls the CNC system and manipulates the tool to manufacture the custom-made component. Many different techniques, including G-code and M-code, are being used in CNC machines. 3. Machine Modification: Before running the CNC software, the user must ready the CNC computer for use. Adding effectively into the unit the work material, into a pin for a machine, or onto machine vices or related hold of work equipment, in addition to adding the needed tool, like cutting tools as well as end mills, to the machine’s right parts, is examples of these preparations. 4. Implementation of Machining Operations: Aside from the necessary equipment, like cutting tools and end mills, they send dictating computer instructions the behavior or actions of the tooling to the computer has been incorporated CPU that controls and deceives the tools of the machine. Introducing the software causes the CNC machine to start the CNC milling procedure, as well as the application controls the machine through the method as it acts as the required machine work to create specially made parts and objects. What are the types of CNC milling methods? DrillingUses of multi-point drill bits to create cylindrical spaces in work material are a form of drilling. The CNC device inserts the rotating drill press opposite the surface level of the workpiece in CNC drilling, ending in vertical alignment space of similar diameters to the drill bit dimension used in the drilling procedure. MillingIt is a technique that uses turn various point cutting machines to strip things from a workpiece. In this process, in most cases, the workpiece is served to the milling cutter in the same position as the movement of the cutting equipment, though in physical milling, the workpiece is supplied in the same position as the motion of the cutting equipment. TurningIt is a technique used at a particular stage cutting devices to separate things from a turning workpiece. To produce cylindrical parts with internal and external features, including gaps flattens. Loops and the unit, which is usually a CNC lathe, serves the cutting tool at a constant speed around the layer of the spinning workpiece, collecting products all over the radius until the required diameter is obtained. The turning mechanism’s operational skills include tedious, posing, rapping, and thread breaking. When deciding between a CNC mill and a lathe, milling is superior for more complicated pieces with its spinning cutting equipment. With revolving mounted cutting instruments and workpieces, lathes work well for quicker, more precise round component formation.Wanna know PCB knowledge? Check and read for more.
PCB Glossary ⋅ 07/16/2021 17:34
Copper clad PCB
The PCB substrate in PCB manufacturing - Copper clad laminate (CCL), which is the most widely and important used to fabricate the boards. The copper clad laminate is a type of material that soaks in resin with the electronic glass fiber or other reinforcing material to make with copper clad on the sides. And it’s widely applied in television, radio, computer, mobile communications and other electronic products. In this passage we are talking about the copper clad and if you are curious about it, please check the content we prepare for you below.If you want to order PCB product, please check and custom your order online. What are the copper clad lamination types? With the development of small, light, thin, multi-functional and high-density electronic products, the integration and assembly density of components on the boards are more and more higher, as well as power dissipation is more and more larger, so the heat dissipation has a great demand on PCB substrates. There will be overheated for the components on the board if the substrates have a poor dissipation, which will lead to the unreliability of whole machine. So the PCB substrate comes into being. There are a lot of kinds of copper clad laminate based on different standard of classification. 1. Classified by reinforcing material: · Paper base CCL ( such as XPC) · Glass fiber cloth base CCL (such as FR-4, FR-5)· Compound CCL ( such as CEM-1, CEM-3) · Special material base CCL (such as metal-base CCL, ceramic-base CCL and so on) 2. Classified by applied insulation resin: · Phenolic resin CCL (such as XPC, XXXPC, FR-1, FR-2 and so on)· Epoxy resin CCL (FR-3)· Polyester resin CCL 3. Classified by performance: · General performance CCL· CCL with high heat resistance· CCL with low dielectric constant· CCL with low CTE (Coefficient of Thermal Expansion) 4. Classified by mechanical rigidity: · Rigid CCL· Flexible CCL What are the materials of copper clad lamination? Copper foil: copper foil is a cathodic electrolytic material that deposited on a thin and continuous layer of metal foil on the base of PCB. And it’s easy ti bond to an insulating layer making a printed protective layer and create a board pattern with corrosion. Prepreg: A prepreg (from pre-impregnated) is fibreglass impregnated with resin. The resin is pre-dried, but not hardened, so that it will flow, stick and completely immerse as heating. So prepregs are fibreglass strengthened by an adhesive layer (similar to FR4 material). as well as it’s known as the types of fibreglass. Different manufacturers have different thickness in the types of prepreg, what’s more, there are the versions "SR" Standard Resin, "MR" Medium Resin "and" HR "High Resin based on the resin content. The best possible material is used depending on the desired final thickness, layer structure or impedance. The mentioned thicknesses are thus to be considered only as examples. What are the standards of copper clad lamination? ASTM D1867 defines the standard specification for copper clad laminates that manufacturers use for making printed circuit boards. Covering twelve grades of copper clad laminates, ASTM D1867 requires the laminates to meet peel strength at elevated temperatures, crosswise and lengthwise flexural strength, flammability ratings, volume resistivity, water absorption, dielectric breakdown, dissipation factor, and permittivity. The laminates must further conform to tests for blistering, warp, and twist. Manufacturers of copper clad laminates follow the IPC-4101C as their manufacturing standard, and the IPC-IM 650 for testing the copper clad laminates they fabricate. What are the advantages of copper clad lamination? Using copper clad laminates for PCBs allows designers take advantage of constant distance between the copper foils acting as power and ground planes. When distributing power to a system, this arrangement reduces the modal resonances by lowering the inductance between the two planes. This not only reduces the impedance of the system, but also decreases the amount of filter capacitors necessary.Wanna know PCB knowledge? Check and read for more.
PCB Glossary ⋅ 07/16/2021 17:30
Immersion gold plating
There are several types of surface finishes when processing the manufacturing process of PCB. But after using for a period, a copper layer surface on PCBs tends to oxidize when into contact with air. In this passage, we are going to talk about the advantages of immersion gold plating. Come and check the content we prepare for you to learn more knowledge.If you want to order PCB product, please check and custom your order online. What are the advantages of immersion gold plating? Easy to Process Structure There are plenty of benefits that are associated with ENIG. However, one of the most significant advantages of this type of printed circuit board surface finish is that it is a natural process mechanism to undertake. Many printed circuit board designers prefer ENIG plating as opposed to Hot Air Solder Leveling or HASL finish or even Nickel Palladium (ENEPIG) based on the fact that HASL is one of the most straightforward processes or finishes to undertake. For instance, matters to do with solderability are essential when working with printed circuit boards. Specific finishes such as ENEPIG and OSP (Organic Solderability Preservative) have previously proved difficult when it comes to soldering them. However, such is not the case for PCB immersion gold finishes. Flat Surface ENIG plating is lately turning out and becoming a popular surface finish preferred by many PCB manufacturers. ENIG consists of a double layer metallic coating consisting of nickel that acts both as a surface and a barrier to which designers can solder the components. It comes in as an ideal answer to the latest industry trends, such as the rise of complicated surface components and lead-free requirements that demand flat surfaces, such as BGAs and flip chips. Again, the ability to perfectly fit into flat surfaces is another advantage associated with ENIG. Good oxidation Resistance Experienced and high-quality printed circuit board manufacturers in the market for PCB surface finishes always look for surface finishes resistant to oxidation. Another significant advantage associated with ENIG surface finish is that such a finish offers excellent oxidation resistance, unlike other surface finishes such as HASL or Nickel Palladium (ENEPIG). ENIG surface plating consists of an electroless nickel plating covered with thin layers of immersion gold that protect the nickel from any oxidation. With few chances of oxidation ever occurring, ENIG finishes ensuring that a printed circuit board is corrosion resistant in addition to assuring it of extended shelf life. Good electrical performance When manufacturing printed circuit boards, every detail matters. The entire placement of wires, finishing touches, and the board's overall design come together towards the manufacture of a printed circuit board that functions as required. When it comes to surface finishing, immersion gold or ENIG surfaces are the preferred choices because they offer excellent electrical performance, unlike other surface finishes such as HASL or ENEPIG. Without a doubt, ENIG is now one of the most widely used finish across the PCB industry because it offers outstanding electrical performance in between all the components of a PCB. High-temperature Resistance A majority of printed circuit boards, especially those that find use in military and medical applications get, are subjected to high-temperate conditions. Unfortunately, when it comes to where such printed circuit boards find much use, plenty of printed circuit board designers find it hard deciding the type of finish to use. Plenty of them –especially those new to PCB design- find it hard to choose the right kind of finish to use, especially when it comes to HASL vs. ENIG. Nevertheless, all is not lost. As a designer, it is advisable to use ENIG finish based on the fact that it can effectively withstand high temperate conditions without affecting your PCB's functionality. An ENIG finish is temperature-resistant and comes with excellent thermal diffusion properties that are excellent for your PCBs. Long Service Life The type of finish used in the manufacture of a printed circuit board determines the shelf life of aboard in months. Depending on the type of finish used, a printed circuit board will last 6, 12, or even more than a year. Unlike other surface finishes used in the manufacture of printed circuit boards, most printed circuit board manufacturers mainly prefer to use ENIG PCB finishes. The reason is that such finishes come with the promise of a long shelf life that lasts up to 12 months or more. For instance, it is a fact that immersion gold finishes last longer compared to other types of finishes, such as OSP, Electro-silver, and Immersion tin, that last for six months on average. Suitable for untreated Surfaces As a designer dealing with PCBs' manufacture, you have to ensure that you protect the untreated surfaces that oxidize immediately when left untreated. While such an exercise may seem easy, in the end, you may find out that such is not the case based on the surface finish that you choose to use. Besides several advantages associated with ENIG, its suitability across untreated surfaces such as contact points and membrane switches, makes it ideal compared to other finishes. Lead-free Regular exposure to high lead levels may bring about several complications such as brain and kidney damage, body weakness, and anemia. High levels of exposure may also lead to death. Another significant advantage associated with immersion gold or ENIG is that it is lead-free, meaning that manufacturers are not exposed to harmful chemicals when using it as a surface finish on PCBs. Suitable for PTH PTH or Plated Through-Hole parts have leads or wires that come out of the bottom or sides, allowing a designer to stick them into a breadboard or effectively sell them into a circuit. Another notable advantage that comes with ENIG is the fact that it’s perfectly suitable for PTH. Unlike HASL finish and OPS, ENIG is the best for matters to do with PTH.Wanna know PCB knowledge? Check and read for more.
PCB Glossary ⋅ 07/15/2021 17:34
ARM development board
ARM Development boards have become the ideal platform to accelerate SoC designs’ development while simultaneously reducing the risk. With the combination of FPGA technology and the ASIC technology used in ARM, boards help deliver an optimal solution for accuracy, speed, cost, and flexibility. Most boards follow a similar design. These boards have limitations for onboard memory, low power running, and the general-purpose input and output pins of their features set and being programmable through the use of a USB cable. Since there are so many boards to choose from, you need to know the differences. These boards can be hard to pick out, especially if you are a beginner without much experience working with ARM development boards. Especially if you don't work coding, or even have experience tinkering with electronics in general.If you want to order PCB product, please check and custom your order online. What are the types of ARM development board？ There are a few different types of ARM development boards that you can use. Their functionality determines each type and what you can do with them. IoT Test Chip Boards The Arm creates a few boards that enable the easier development of Arm IP of real-life conditions and evaluates them. Popular uses of this board include simplified integration of ARM TrustZone technology for security. Having an improved understanding of the trade-offs as well as the performance of IP inside SoC designs. Use these boards to make progress on software before making it available. Juno Development Platform Is the Armv8-A platform for development? It is a development of software that includes Juno Arm Versatile Express Board and the Armv8-A reference software port only available through Linaro. You can use these boards for system control processors and firmware. Use these boards also for system initialization, clocked controls, voltage, and even power gating. Deliver AP software through Linaro and use ARM Trusted Firmware. The support of this board includes Linux, Busybox, and Android. Neoverse Reference Designs References the useful designs as resources with best practices and integrating into a Neoverse subsystem inside a more massive SoC. Use these boards in servers, networking-storage, security offloads, edge computing nodes, 5G stations, and even access points. Mbed Development Boards These are boards designed for fast, low-risk, flexible, and professional prototyping that is rapid. Mbed supports most MCU families of boards. These boards include STM32, Kinetis, PSoC, NRF52, and LPC. Helping you, these boards develop the Internet of Things quickly, efficiently, and securely with all the products in junction with IoT. Keil Evaluation Boards The manufacturing and design of these boards and the starter kits help you evaluate an MCU architecture and start with Keil tools. Kiel boards have an extensive range of evaluation ARM boards. These boards support CAN, USB, Ethernet, SD Card, serial interfaces, LCD. They are available as starter kits. Design Start DAP Link Boards It is a board for Serial Wire Debug and UART access that is a design built on the board itself. Features of DAP Link include USB devices with Serial Wire Debug, drag, and drop programming with FPGA images, and they have a dedicated QSPI flash. There is a micro-SD but only for SPI application. CMSIS Board Support Packs Define a general standardized method of delivering software components, board support information, and device parameters and code. These boards provide the interfaces to processor and peripherals as well as real-time OS and components of middleware. This board will simplify software interfaces for re-use. What is the application of ARM development board？ The application of ARM development boards helps to provide systems on modules and make use of ARM processors. These boards offer development kids with hardware and software included helping with the design and prototypes of ARM-based applications. These applications have the purpose of built-in for industrial uses or architecture. These boards feature sockets designs so that they can receive MitySOM-1808 modules or MityDSP-L138 modules. ARM boards are printed circuits containing the support logic required for the engineering of the application of microprocessors of interest. ARM development boards' application is accelerating the entire production from SoC architecture until it reaches the software application development. These applications are from the tiniest Cortex-M series of microcontroller sensors up to entire supercomputers. Arm development tools and service designs will help engineers worldwide deliver leading products on the market to explore all ARM-based systems’ capabilities. The Key benefits of ARM boards include: · Benchmarking, evaluating, and starting software development through the use of new arm processors.· It allows you to test logic blocks along with system IPs in FPGA that connect to an ARM that is running ASIC speed.· Validates, prototypes, and develops software drivers for all new SoC IP blocks.· Common mistakes that come with tool settings will be practically eliminated, and the minimization of configuration time.· Accelerate the development of applications. During editing, there is the possibility of configuring debugging features. At the same time, you can modify the source codes.· All safety-critical systems have the opportunity to be thoroughly tested and officially validated.· It accurately simulated all sophisticated systems through the addition of peripheral drivers.· Use these boards as access points where connectivity is limited.· Servers can integrate seamlessly with other interfaces.Wanna know PCB knowledge? 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PCB Glossary ⋅ 07/14/2021 17:22
Land pattern in PCB
A land pattern is the arrangement of pads on a circuit board. Primarily, a land pattern attaches and connects the electronic component on a circuit board depending on the layout and the design of the board. It is also important to note that land patterns should always match with the arrangements of lead. So, why is it essential? Designing the land part is essential since it ensures reliability by determining the solder joint. It makes it easier to identify defects in the solder joint. Besides, it plays a broad role in repairing, testing, and cleaning the solder joint. In this passage we will focus on land pattern in PCB and please check the content below for more professional knowledge about it.If you want to order PCB product, please check and custom your order online. What are the differences between land pattern and footprint? What is the Footprint? In the PCB world, the word footprint refers to a pattern that resembles the electronic component soldered there, irrespective of the connector you will use. An impression reaches your physical foot. When you stand on the sand, you will notice some dent that looks like your foot. How do we distinguish between Land pattern and Footprint? In PCB assembly, the word footprint and land pattern might mean the same thing and sometimes might differ for several reasons. You need to realize that when someone uses these words, there is a distinction. The observable difference between the two terms is that a footprint resembles a person’s foot. When you press your leg in soft sand, you notice the impression left behind. For a land pattern, it is the size of the pads. It resembles a part that is already there, which you design into PCB. The PCB footprint is defined as the physical interface among electronic components or land pattern and printed circuit boards which is also comprising of the information of documentation such as reference, polarization mark, and outline. The land patterns are either derived from the dimensions of the component’s tolerances included or taken from the datasheet. This all is as per the standards of industry. Most probably the land patterns are also derived from same standard. It must have all of the connection points which are known as pads for soldering all of the electronic components over sit. The size, position, and shape of the pads must be aligned with the specifications of the datasheet for avoiding faults. The pads are defining the features to be appearing on the paste layer, masks, and copper. The copper is known as the area which is covered by copper layer. Masks are the cutout region over the layer of solder mask, whereas paste the region of cutout over solder paste stencil which is utilized for the reflow soldering. The courtyard area is where none of the components are to be placed. The courtyard area is usually very large than that of combined parts body and pads area. What is IPC-7351 standard? Universally, PCBs must conform to specific standards formulated by the Institute for Interconnecting and Packaging Electronic Circuits. It is a trade organization that sets up various standards that protect both manufacturers and consumers from ensuring safer PCB products. The IPC -7351 refers to the set dimensions you must use to create a land pattern essential for PCB footprints. These dimensions include: · pad spacing (labeled as G),· the pad width (labeled X),· the pad end to end dimension (labeled Z).· They will help in the accommodation of component spacing, thereby preventing solder defects. You need to understand that there is a need to calculate the G, X, and Z. the first thing we will know about is the formula to use;2When designing, you need to ensure that the land pattern can accommodate solder fillet on every lead’s edge. Here you use three J values as shown above. For parameter S, you measure the component’s outer edge while measuring the end of the charges. The minimum and maximum dimensions mean that you need to include dimensional tolerance. You use the letter C to show patience for each size. Other matters of IPC-7351 standard One world CAD library is what the IPC-7351 bar has createdDoing, increasing the consistency of the PCB footprint. When it comes to print, it is more than the drawings done on paper. It will include the PCB land pattern, solder mask, component outline, and silkscreen markings when you use CAD software. When designing your land pattern, when you use CAD software, it is careful to recommend sizes. Ensure you do not violate the standards set. Description of land pattern size design There is a need to confirm the size of the land pattern. It will help you to decide on the best amount of solder that you use. The size of the solder you use to mount a capacitor plays a broad role in influencing capacitor directs on the printed circuit. Therefore, you need to make enough consideration when deciding. When designing your land pattern and your amount of solder is much, you cause trouble to the capacitor. It may easily crack. It necessitates the need to set up the right size of the land pattern for the solder amount. Again, when the solder amount is little than required, the terminal’s strength will not be enough. Your capacitor may drop from the printed wire board. It also affects the reliability of the circuit. When it comes to the actual standard size, creepage distance should be 2.5 or even more. For the dimension, a suitably certified capacitor should be 3.0 to 3.5 mm. To prevent electrical discharge, you need to ensure a slit between the lands or cleaning.Wanna know PCB knowledge? Check and read for more.
PCB Glossary ⋅ 07/14/2021 17:12
Vapor phase reflow
Vapor phase reflow refers to an advanced PCB soldering technology that uses an inert liquid with a high boiling point. This technology has, in recent years, gained massive popularity among large scale PCB assemblers. To solder electronic components to PCBs, manufacturers usually need high temperatures. It’s a complex process that has become even more challenging as electronic components become smaller. Vapor phase reflow soldering ensures that the PCB board and its members don't face temperatures higher than necessary. For that reason, parts don't overheat. This soldering process provides the ideal wetting of the details. Moreover, the entire soldering process takes place within an inert atmosphere. In the end, PCB assemblers get the highest possible PCB soldering results. In this passage we will focus on the details knowledge about vapor phase reflow and please read the content we prepare.If you want to order PCB product, please check and custom your order online. Why we use vapor phase reflux? Vapor phase reflow if quickly replacing other soldering technologies in the market. There are many reasons for this development. We look at two of them in this section. The Welding Problems Faced The vast majority of manufacturers now opt for leadless solder bases. These bases need manufacturers to use even higher temperatures to melt the solder effectively. As a result, the risk of damage to the electronic units due to overheating is higher. Vapor phase reflow technology helps counter this problem by virtually eliminating temperature fluctuations, topography, and board layout. PCB Circuit Board Components PCB circuits need require parts of different masses, which makes the soldering process a complicated one. That’s because the heat these components store varies significantly based depending on their groups. The result is that there’s uneven heat distribution, which could lead to warping of the PCBs. To reduce these issues, PCB assemblers and designers opt for vapor phase reflow. What is the working principle of vapor phase reflux? To understand how vapor phase reflow works, we need to look at three different things: · Heat adjustment· Level adjustment· Void formation Heat Adjustment Heat adjustment involves PCB engineers adjusting the temperature gradients in vapor phase reflow equipment. They do so by regulating the power that goes to the equipment’s heating elements. As more power goes to the heaters, there’s more vapor production. It means more heat transfer to the PCB assembly, even though the liquid’s boiling point remains the same. As we hinted earlier, the vapor phase reflow takes place in an atmosphere that's entire oxygen-free. This atmosphere reduces the likelihood of oxide formation. It also improves wetting. Usually, there's a slight delay in the creation and the subsistence of vapors. Thus, there's no creation of sophisticated temperature profiles. To solve this challenge, manufacturers developed soft vapor phase (SVP) machines. Level Adjustment One of the top benefits of SVP machines is that they allow you to control immediate temperature gradients. During the SVP process, the PCB's temperature rises as it moves deeper into the vapor blanket. To achieve the ideal preheating of the PCB board, hold it at a specific depth. Note that as you increase the center, the board will move towards liquidus temperature. Assemblers and designers can create just about any thermal profile they want. They do so by automatically preselecting and controlling the soldering time. As soon as you're through soldering, the SVP machine will move the board up from the depths of the vapor blanket to the vapor boundary. Here, the board's temperature lowers. You can then lift the board out of the vapor to allow it to cool down. Usually, the SVP process doesn't need any extra mechanisms to stop overheating. That's because the liquid's boiling point limits the PCB's peak temperature. Void Formation The void formation is inevitable with vapor phase reflow. Voids can compromise or diminish both the thermal and electrical conductivity of a solder joint. So, how do engineers mitigate void formation? One effective way is through a vacuum controlled procedure that outgasses these voids. When you reduce the pressure over a liquid, its boiling point reduces, and vice versa. Using a vacuum can extend the time above liquidus by 30 seconds or so, reducing existing voids and stopping new ones from forming. Of course, you should conduct void reduction when solder joints are liquids.Wanna know PCB knowledge? Check and read for more.
PCB Glossary ⋅ 07/13/2021 09:06
The selection of PCB substrate will influence the performance, durability and quality of finished products. In this passage, we will lead you to learn everything about PCB substrate, how to select with different requirements. Come and check the content we prepare for you.If you want to order PCB product, please check and custom your order online. How surface roughness affects the quality of your PCB? If your goal is to design a suitable circuit, you also need to consider how rough the copper foil surface will be. Roughing will ensure that the conductors have peel strength and that bonding of the substrate material and the copper foil is optimal. The standard roughness nowadays is set to around 5μm. If you want to boost peel strength, it may be wise to embed hump on the foil into the substrate. In this case, you want to keep the roughness as low as possible (preferably up to 1.5μm, but no more than 3μm). You may be wondering how to peel strength will be kept if you reduce the foil roughness. The answer lies in the superior finish you apply to the surface of both the substrate and the foil. That way, the conductors can maintain optimal peel strength and ensure the reliable performance of your PCB. Copper foil requirements PCB substrate materials play an integral role in determining the durability and quality of your board. It is noticeable that the manufacturers are trying to move towards fine lines and high density. You may have heard of the term HDI PCB. It stands for High-Density Interconnect Printed Circuit Board. Approximately ten years ago, a board needed to have line space (S) and line width (L) of not more than 0.1mm to be classified in the HDI category. Today, the standards vary from one industry to another. Electronic products often have S and L set as low as 60μm, and they can even go to 40μm in advanced applications. During circuit pattern formation, S and L can reach a value as low as 30μm once you apply a thin substrate made of copper foil. The recommended thickness can go from 9μm to 12μm. The problem is that CCL (copper clad laminate) that is so thin can be expensive and prone to defects. It is the best explanation for why companies resort to using 18μm-thick copper foil. However, if S and L are not more than 20μm, the copper foil of standard thickness might not be the best solution. What types of substrate materials could be used in high-frequency PCBs? You can find suitable material in one of the following: • Fluorine-series resin – materials like PTFE have excellent dielectric performance and can be a great choice if you need at least 5GHzfrequency. Their cost is probably the highest of all three types, and they have a high thermal expansion coefficient. However, they perform impressively in areas of dielectric loss and constant and absorbing water. • PPO or PPE resin – a suitable option for 1-10GHz frequencies. They secure an all-around decent performance of your board. • Modified epoxy resin – they can also be the right choice for frequencies between 1GHz and 10GHz. In general, they have the most affordable cost, which is the reason for their popularity. For example, we will consider PTFE, which falls into the fluorine-series category. It has excellent dielectric performance and can be a great choice if you need at least a 5GHz frequency. Please note that signal loss may also be due to the high roughness of the copper. It is why you should ensure to keep copper roughness under 1μm. Furthermore, it may be wise to go with roughness no bigger than 0.04μm. We need to consider lamination material and its requirements if we are going to design HDI PCBs. Some considerations include dielectric performance, thermal capacity, insulation, and bonding. If you look at packages, the IC package may turn organic substrate from the ceramic. A decrease in the size of the FC package is noticeable as the values of S and L are around 15μm, with the tendency to become even more compact. Multi-layered PCB substrate materials should reduce the thermal expansion coefficient and dielectric property while securing optimal resistance to heat. This type of substrate is the right choice as it can achieve all performance goals while maintaining an acceptable cost. We use SAP technology in the manufacturing process of circuits when their space and width are below 10μm. In fine circuit production on a large scale, MSPA can be applied to thin copper foil to insulate dielectric lamination. How to choose PCB substrate materials? You have the choice of picking from three different PCB types: • Rigid• Flexible• Flex-rigid The primary goal is to pick a board that will be perfect for your product. Many people aim for compact size and shape, but they forget about performance. Polyimide film can be a smart choice as it is versatile, and it can fit into different categories like black, white, and transparent. It also ensures a low thermal expansion coefficient while maintaining adequate resistance to heat. Mylar substrate, on the other hand, is very elastic, and it has excellent resistance to environmental factors. On top of that, it is relatively affordable, which is why many users consider it. Flexible PCBs have to strive to achieve the same level of performance in terms of frequency and speed as standard PCBs. Advanced polyimide substrate and polytetrafluoroethylene are smart choices for flexible boards. You can find flexible boards in many industries, including medicine, smart phone, and the gadget industry. That is why the market has been implementing changes in multi-layer boards that are flexible and extra thin (0.2-0.4mm). At this point, you can expect flexible boards to secure speed of up to 5Gbps, but you will need to use a low Dk/Df substrate material. It is also smart to use conductors that have over 100μm of thickness as that will help to handle the amounts of current and power.Wanna know PCB knowledge? Check and read for more.
PCB Glossary ⋅ 07/10/2021 17:25
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