Mechanical suitability tests are designed to subject products to suddenly applied forces and/or abrupt changes in direction to determine overall integrity.
If you need your electronic equipment to withstand rough handling, transportation or field operation, mechanical shock and vibration testing is essential. Each of these dynamic mechanical analysis (DMA) tests may cause the loosening or relative motion between parts in a specimen, which in turn may produce objectionable operating characteristics such as noise and wear. Mechanical testing often results in fatigue and failure of mechanical parts.
Constant acceleration testing is a centrifugal test performed to simulate constant acceleration effects on semiconductor packages. This test indicates types of mechanical and structural weaknesses not necessarily detected in vibration or mechanical shock testing via constant acceleration.
Fiber integrity testing is required for all optoelectronics and integrated modules with fiber pigtails to ensure the attachment or wavelength stabilization of a fiber pigtail to a package.
Transportation testing determines how containers, packages or packaging components hold up to particular field conditions that they encounter during their life or testing cycle.
Mechanical shock testing determines the suitability of a device for use in equipment that is subjected to moderately severe shocks from rough handling, transportation or field operation.
Random vibration testing determines the effects of vibration within the predominant frequency ranges and magnitudes encountered during field service and/or transportation on components.
Resistance to solvent testing ensures that solvents do not cause deleterious, electrical or mechanical damage, in addition to deterioration of the material or finishes.
Particle impact noise detection (PIND or PIN-D) is designed to identify loose particles inside a device cavity.
Semiconductor parametric testing includes electrical testing of active devices in non-production quantities.
Solderability testing establishes whether the packaging materials and processes used during manufacturing operations produce a component that can be successfully soldered in the next level assembly.
Variable frequency vibration testing is the standard method to evaluate the ability of parts to withstand vibrations of varying frequency within a specified frequency range.
The solder heat resistance test (SHRT) determines whether semiconductor device terminations can withstand the effects of heat at the level they will be subjected to during the soldering process.
Physical dimension testing uses an automated optical imaging system that measures and verifies the conformance of a device’s physical dimensions based on your specifications.