Towards Every Pocket
At the end of the 1990s the micromechanical pressure sensors and accelerometers existed in relatively large volumes for the automotive industry. The sensor elements, signal conditioning electronics and the packaging were developed according to the automotive system and environmental requirements. When consumer electronics and mobile phone manufacturers became interested in sensors and other MEMS devices suitable for their products, immediately they faced some challenges:
- The interface electronics with sufficiently low power consumption and low supply voltage level did not exist.
- Even though a large variety of packaging standards existed, the miniaturization had not addressed the critical requirement of thinness. ...